随着信息化时代的来临，信息量爆炸式增长，采用传统的集成电路处理庞大的数据已经越发捉襟见肘。而光子集成回路和光子芯片具有低功耗、高速率、大带宽等优势，是未来光信息处理系统的一种可行方案。光子芯片一般包括片上光源、信号处理和信号探测三个主要部分。把具有不同材料、不同结构和不同功能的微纳光子器件精确、可控地集成在单个芯片上是实现光子芯片的关键技术之一。

With the advent of the information age and the explosive growth of information, the traditional integrated circuit has become more and more difficult to deal with the huge data. The photonic integrated circuit and the photonic chip have the advantages of low power consumption, high speed and large bandwidth, which is a feasible scheme for the future optical information processing system. Photonic chips generally consist of three main parts: on-chip light source, signal processing and signal detection. It is one of the key technologies to realize photonic chip to accurately and controllable integrate micro-nano photonic devices with different materials, structures and functions on a single chip.

近日，北京大学“极端光学创新研究团队”发展了一种高精度的暗场光学成像定位技术（位置不确定度仅21nm），并结合电子束套刻工艺，实现了片上量子点微盘激光器与银纳米线表面等离激元波导的精确、并行、无损集成。这种微盘－银纳米线复合结构同时具有介质激光器与表面等离激元波导的优势，因此不仅具有介质激光器的低阈值与窄线宽特性，而且具有表面等离激元波导的深亚波长场束缚特性。基于这种灵活、可控的制备方法，他们实现了片上微盘激光器与表面等离激元波导间多种形式的精确可控集成，包括切向集成、径向集成以及复杂集成，并且对量子点无任何加工损伤；进一步，通过同时集成多个片上微盘激光器与多个银纳米线表面等离激元波导，他们获得了多模、单色单模以及双色单模的深亚波长（0．008λ2）相干输出光源。

circuits has important applications, and this method can be extended to other materials, and other functions of micro-nano integrated photonic devices, for the future of the photon chip implementation provides a feasible solution.
This work was published on Advanced Materials (Advanced Materials 2018, 30, 1706546) in May 2018, and was highlighted in the form of Frontispiece. The

这些高性能的深亚波长相干输出光源可以容易地耦合并分配至其它深亚波长表面等离激元光子器件和回路中。因此，这种灵活、可控的精确集成方法在高集成密度的光子－表面等离激元复合光子回路中具有重要应用，并且这种方法可以拓展到其它材料和其它功能的微纳光子器件集成中，为未来光子芯片的实现提供了一种可行的解决方案。

first author of this paper is rong kexiu, a doctoral candidate in the school of physics, Peking University. The research backed by the national natural science foundation, ministry of science and technology, state key laboratory for artificial microstructure and mesoscopic physics, quantum material science collaborative innovation center and extreme optical support collaborative innovation center, etc.

该工作于2018年5月发表在Advanced Materials上（Advanced Materials 2018， 30， 1706546），并以卷首插画（Frontispiece）的形式予以重点报道。文章的第一作者为北京大学物理学院博士研究生容科秀，陈建军研究员为通讯作者。该研究工作得到了国家自然科学基金委、科技部、人工微结构和介观物理国家重点实验室、量子物质科学协同创新中心和极端光学协同创新中心等的支持。

processing system. Photonic chips generally consist of three main parts: on-chip light source, signal processing and signal detection. It is one of the key technologies to realize photonic chip to accurately and controllable integrate micro-nano photonic devices with different materials, structures and functions on a single chip.

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